
400Gbps QSFP DD To 4x QSFP56
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
The QSFP-DD (dual-density) interconnect system and cable assembly has an eight-channel electrical interface, with data transmission rates up to 28Gbps NRZ or 56Gbps PAM-4, and total data rates up to 200Gbps or 400Gbps.
Application:
• Switch/Router
• Servers and storage
• Data center network
▪Eight-channel electrical interface with data rates up to 28Gbps NRZ or 56Gbps PAM-4
▪Support I2C interface, easier to control
▪Support hot plug
▪Low crosstalk
Technical parameters
▪Complies with SFF-8636 and QSFP-DD multi-source protocol standards
▪Compliant with IEEE802.3bj & IEEE802.3 cd standard
Recommend Products
Thermal interface material high thermal conductivity potting adhesive
High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.
Thermal interface material Thermal conductive gel
Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine
Thermal Interface Material Thermal Gasket
Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.
Thermal interface material Thermal conductive silicone grease
It is a common interface thermal material, often applied by printing or dot coating.
Online Consultation