Thermal interface material Thermal conductive gel
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Classification:
Detailed description
The deformation force is very low thermal conductivity material, has a certain fluidity, strong plasticity, similar to plasticine
◆ Low interface thermal resistance can meet the requirements of various designs for material heat dissipation performance
◆ Very low hardness and plasticity can be arbitrarily formed, suitable for thermal modules or components with large thickness changes, with almost no hardness, and no internal stress on the equipment after use.
◆ Its inherent adhesive properties, no adhesive layer, at the same time has good wettability, can cover the micro uneven surface so that the mating parts contact and improve the heat transfer efficiency
◆ It has superior electrical properties, aging resistance, cold and heat resistance (can work for a long time at -50~200 ℃), electrical insulation performance, shock resistance, vibration absorption and stability, which increases the safety factor of electronic products in the use process;
Two-component thermal conductive gel model
Single component thermal conductive gel model
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