Baicao BEGEL8018 double-liquid potting gel (thermal gap adhesive)
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
Product characteristics
Baicao BEGEL8018 double-liquid potting gel (thermal gap adhesive)
◆ Good self-foaming property after mixing
◆ Low viscosity, strong operability
◆ Excellent low temperature characteristics, excellent weather resistance
◆ Excellent electrical insulation, electrical stability
Good waterproof, moisture resistance, low water absorption
◆Good adhesion to most metals and plastics
Product Application
Baigao BEGEL8018 double-liquid potting gel (thermal gap glue) can be used for potting sensitive sensors in high humidity and heat environments, transparent shock-absorbing gel for electric tools, and also for potting waterproof sealing of cable junction boxes.
Method of use
Preparation before use
Preparation of raw materials: It is recommended to pour the whole barrel of combined materials into the material cylinder and stir evenly. It is also possible to roll the combined materials in the barrel evenly before pumping the materials into the material cylinder.
Defoaming treatment: In order to prevent the generation of bubbles in the finished product, each material cylinder needs to be defoamed before production: usually under a pressure of 0-2mmHg, stirring and vacuuming for 10 minutes, and then starting the glue filling work.
Mixing ratio error: The deviation of the mixing ratio will affect the demoulding time and mechanical properties of the product, and the error is best <0.5%.
Others: During the production process, the material tank is always kept closed. If compressed gas is required, it must be dry, otherwise the B material will become viscous and affect the mechanical properties of the finished product.
Recommended processing conditions
Machine: pouring type low press (gear pump or volumetric metering pump or plunger pump)
Mixing method: recommend use static or dynamic mixers
Material temperature: material a: 25-30 ℃ material B: 25-30 ℃
Mold temperature: 100-110 ℃
Demoulding time: 5mins
Setting of equipment anti-curing time: the operation time of glue is about 5mins, and the setting of equipment anti-curing spitting can be controlled at 5mins. Baicao BEGEL8018 double-liquid potting gel (thermal gap adhesive)
Product Parameters

Recommend Products
Thermal interface material high thermal conductivity potting adhesive
High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.
Thermal interface material Thermal conductive gel
Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine
Thermal Interface Material Thermal Gasket
Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.
Thermal interface material Thermal conductive silicone grease
It is a common interface thermal material, often applied by printing or dot coating.
Online Consultation