Baigao BEPU 6608 Black White Low Viscosity Two-Component Polyurethane Thermal Conductive Potting Adhesive
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Detailed description
Product characteristics
Baigao BEPU 6608 Black White Low Viscosity Two-Component Polyurethane Thermal Conductive Potting Adhesive
◆ Low viscosity, strong operability
◆ Excellent low temperature characteristics, excellent weather resistance
◆ Excellent electrical insulation, stability
Good waterproof, moisture resistance, water absorption rate is very low
It has good adhesion to most metals and plastics
Product Application
Baigao BEPU 6608 black white low viscosity two-component polyurethane thermal conductive potting adhesive is used in pouring and potting of communication equipment, transformers, control power supplies, ignition controllers, electronic sensors, etc.
Method of use
◆ Preheating: Please bake the cast device at 70~80 ℃ for 1~2 hours. The temperature may also be lowered and the heating time extended to remove moisture from the device. Bepu 6608 at low temperature, the viscosity will become high, can preheat the material to 25 ℃ ~ 45 ℃. Ease of use.
Mixing: according to the proportion of weighing A, B material, stirring vertical stirring rod, clockwise (or counterclockwise) in the same direction for 2~3 minutes, to minimize stirring into the air. Note that the bottom and edge of the container should also be stirred evenly, otherwise there will be local non-curing phenomenon.
◆ Defoaming: If the surface of potting is required to be smooth and free of bubbles, the mixture shall be vacuumed (≤-0.1mpa) to remove bubbles. Dynamic defoaming while stirring and vacuuming is more conducive to the removal of bubbles. For mechanical metering mixed potting, steps 2 and 3 are omitted.
◆ Pouring: pouring the mixture into the device. If the device has complex structure and large volume, it should be poured in different times. Pouring bubbles can be purged with a hot air gun, etc. Can eliminate the surface bubble.
◆ Curing: 25 ℃/(8-10)h, or 80 ℃/1h can be cured. The ambient humidity should be controlled at <70%, and the curing time should be extended as appropriate if the temperature is low.
Product Parameters
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