BAIGO BESIL 9445 Thermal Conductive One-Component Addition Silicone Adhesive Sealant
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Detailed description
Product characteristics
Baygao BESIL 9445 Thermal Conductive One-Component Addition Silicone Adhesive Sealant In some cases, BESIL may not achieve the best curing performance 9445 bonding some plastics and rubbers. This problem can be better solved if the substrate is previously treated with a solvent or slightly baked above the curing temperature.
Product Application
Baigao BESIL 9445 thermally conductive one-component addition silicone adhesive sealant is specially designed to provide long-term thermal stability bonding for various metal, glass, plastic and ceramic substrates. Typical applications include: bonding of plastic shells and aluminum plates for automotive electronics, sealing of steam chambers and soleplates for electric irons, bonding of heating elements, and fixing of wafers.
Method of use
Surface Pretreatment
◆ In order to achieve the best bonding effect, all surfaces must be cleaned and degreased with suitable solvents, such as naphtha, methyl ethyl ketone (MEK), alcohol, BESIL CLEANER 20, etc., and ensure that all solvents are volatilized.
In general, it is also possible to bond the surface without solvent treatment, but the result will depend on the degree of contamination of the surface of the substrate and the nature of the substrate.
◆ For materials that are difficult to bond, such as the bonding of epoxy powder spraying parts, the primer BESIL 1268 of Baigao Despotism can be used for treatment, and the glue can be applied after the surface is basically dry.
Product Parameters
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