BESIL 8550 one-component addition bonding sealant
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  • BESIL 8550 one-component addition bonding sealant

BESIL 8550 one-component addition bonding sealant

We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.

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Detailed description

Product characteristics

BESIL 8550 one-component addition bonding sealant
◆ Single component
◆ Heating and curing
◆ Half flowing
◆Good heat resistance
◆ Good adhesion
◆ Temperature resistance up to 300 ℃

Product Application

BESIL 8550 one-component addition bonding sealant
◆ PTC ceramic sheet and electrode sheet bonding
◆ PTC ceramic sheet and heat dissipation aluminum strip bonding

Method of use

BESIL 8550 one-component addition bonding sealant
Remove the oil or impurities on the surface of the substrate to be bonded, wipe and dry with alcohol and other solvents if necessary, and then apply the glue directly.

Product Parameters

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