Baigao BEEP 6113 High Temperature Resistant Two-Component Epoxy Heat Conductive Potting Adhesive
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Detailed description
Product characteristics
◆ Excellent adhesion and cracking resistance
◆ Low CTE linear expansion coefficient
◆ High thermal conductivity
◆ Excellent electrical insulation, stability
◆ Long-term use at 150 ℃-180 ℃
The water absorption rate is very low, good waterproof, moisture resistance
Product Application
It is suitable for packaging and protection of products with high thermal conductivity requirements in motors, automotive electronics, power tools, reactors, and meters, and has excellent adhesion and temperature resistance.
Method of use
◆ Glue blending: As the filler contained in component A will settle down with the placing time, component A will be mixed evenly in the original package before use, and then components A and B will be weighed and proportioned according to the weight ratio of 100:8, and potting can be carried out after mixing evenly.
B component in the storage process may appear crystallization or caking (belongs to the normal situation), if the crystallization needs to be placed in the 80 ℃ oven before use to melt, and then cooled to room temperature after use, this does not affect its performance.
B component exposed in the air will react with moisture hydrolysis phenomenon, hydrolysis product is white powder material. Try to avoid pouring white material when weighing.
The potting good device if necessary, can continue to vacuum, is conducive to increasing the electrical properties of the device.
◆Curing conditions: 25 ℃ * 24 hours. For better performance, please follow the curing process of 100 ℃ * 2 hours or 80 ℃ * 3 hours.
Product Parameters
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