Baigao BEEP 6002 6005 Two-component Room Temperature Fast Curing Epoxy Adhesive (Potting)
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
Product characteristics
Baigao BEEP 6002 6005 Two-component Room Temperature Fast Curing Epoxy Adhesive (Potting)
◆ Resistant to moisture, dirt and other atmospheric components
◆ High strength, excellent cohesiveness
Good anti-pollution, low surface pretreatment requirements
◆ No solvent, no curing by-products
◆ Stable mechanical and electrical properties between -45-120 ℃
◆ Good adhesion to glass fiber cloth and steel plate
Product Application
BEGO BEEP 6002 6005 two-component room temperature fast-curing epoxy adhesive (potting adhesive) This two-component epoxy adhesive is designed to bond ceramics, metals, glass, plastics, rubber, paper, cloth and other products.
Method of use
◆ 50ml and double-barrel support, use a 1:1 mixing glue gun for construction, and drain the glue from the mixing tube at the beginning to prevent poor bonding effect caused by uneven initial mixing. Double-tube packaging should pay attention to the mouth sealing, and timely replacement of mixing hose.
◆ Manual use of bulk packaging, mixing glue need to be quickly weighed and stirred, this method is suitable for bonding requirements are not high places; otherwise you need to use a two-component dispenser mixing glue.
◆ If the temperature is too low, the curing speed will be slow. When the initial strength cannot be reached, the constant temperature control on site is required.
◆ Cartridge packaging needs to be kept sealed during use.
Product Parameters
Recommend Products
Thermal interface material high thermal conductivity potting adhesive
High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.
Thermal interface material Thermal conductive gel
Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine
Thermal Interface Material Thermal Gasket
Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.
Thermal interface material Thermal conductive silicone grease
It is a common interface thermal material, often applied by printing or dot coating.
Online Consultation
Contact Phone:+86 13510478804
E-mail:tingyu yuan@easystrive.com
Address: 12th Floor, Block C, Kupai Building, Intersection of Keyuan Avenue and Baoshen Road, Nanshan Gaoxin North District, Songpingshan Community, Xili Street, Nanshan District, Shenzhen
Focus on us