Baigao BEEP 6211-146 Two-component Epoxy Structural Adhesive
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
Product characteristics
Baigao BEEP 6211-146 Two-component Epoxy Structural Adhesive
◆ Resistant to moisture, dirt and other atmospheric components
◆ High strength, excellent cohesiveness
Good anti-pollution, low surface pretreatment requirements
◆ No solvent, no curing by-products
◆ Excellent high and low temperature resistance,-50 ℃-180 ℃
◆ Transformer oil resistance, low attenuation
◆ Good adhesion to glass fiber cloth and steel plate
Product Application
This two-component adhesive is designed for metal bonding, SMC glass fiber reinforced plastic parts bonding, aluminum honeycomb panel splicing and motor products magnetic steel magnetic tile bonding, ceramic membrane component sealing, soft magnetic unit potting, high temperature sensor potting, etc.
Method of use
◆ Glue blending: After component A is evenly stirred in the original package, components A and B are weighed and proportioned according to the weight ratio of 100:45.
◆ Stir evenly and vacuum defoam for use, and use up within 80 minutes.
The potting good device if necessary, can continue to vacuum, is conducive to increasing the electrical properties of the device.
◆ Curing conditions: 80 ℃ * 1 hour, 40 ℃ * 16 hours or 25 ℃ * 24 hours.
◆ If you need to use glue filling equipment, please consult the marketing department of our company.
Product Parameters
Recommend Products
Thermal interface material high thermal conductivity potting adhesive
High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.
Thermal interface material Thermal conductive gel
Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine
Thermal Interface Material Thermal Gasket
Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.
Thermal interface material Thermal conductive silicone grease
It is a common interface thermal material, often applied by printing or dot coating.
Online Consultation
Contact Phone:+86 13510478804
E-mail:tingyu yuan@easystrive.com
Address: 12th Floor, Block C, Kupai Building, Intersection of Keyuan Avenue and Baoshen Road, Nanshan Gaoxin North District, Songpingshan Community, Xili Street, Nanshan District, Shenzhen
Focus on us