Baicao BESIL9420 One-Component Addition Curing Silicone Adhesive Sealant
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
Product characteristics
Baicao BESIL9420 One-Component Addition Curing Silicone Adhesive Sealant
◆ One-component semi-flowing, fast heating curing
◆ Transparent or chromosomal silicone elastomer adhesive
◆ Can be bonded to more substrates without primer, such as stainless steel, glass, ceramics, etc.
◆ Excellent flexibility and tear resistance
◆ Addition curing system: no curing by-products
◆ Through ROHS\REACH certification
◆ Maintain elasticity and stability in the temperature range of -60 ℃ ~ 280 ℃
Product Application
◆ Designed for a variety of metal, glass, silicone rubber, plastic, mica sheet, ceramic substrate to provide long-term thermal stability bonding design.
◆ Typical applications include: bonding of plastic shell and aluminum plate, sealing of steam chamber of electric iron, bonding of motor control box and heating element.
Method of use
◆ In order to achieve the best bonding effect, all surfaces must be cleaned and degreased with suitable solvents, such as naphtha, methyl ethyl ketone (MEK), alcohol, BESIL CLEANER 20, etc., and ensure that all solvents are volatilized.
In general, it is also possible to bond the surface without solvent treatment, but the result will depend on the degree of contamination of the surface of the substrate and the nature of the substrate.
◆ For materials that are difficult to bond, such as the bonding of epoxy powder spraying parts, the primer PM1268 or PM 1266 of Baigao autocracy can be used for treatment, and the glue can be applied after the surface is basically dry.
Product Parameters
Recommend Products
Thermal interface material high thermal conductivity potting adhesive
High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.
Thermal interface material Thermal conductive gel
Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine
Thermal Interface Material Thermal Gasket
Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.
Thermal interface material Thermal conductive silicone grease
It is a common interface thermal material, often applied by printing or dot coating.
Online Consultation
Contact Phone:+86 13510478804
E-mail:tingyu yuan@easystrive.com
Address: 12th Floor, Block C, Kupai Building, Intersection of Keyuan Avenue and Baoshen Road, Nanshan Gaoxin North District, Songpingshan Community, Xili Street, Nanshan District, Shenzhen
Focus on us