Baicao BEEP 6688 Solvent-free Heating and Curing One-component Epoxy Structural Adhesive
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Detailed description
Product characteristics
◆ This product is heating curing type, has good temperature resistance, low total chlorine.
◆ It needs to be heated and cured, and it needs to be stored at low temperature (below -10 ℃).
◆ After curing, it has strong toughness, high bonding strength, impact resistance and vibration resistance.
◆ The cured product has good acid and alkali resistance, moisture-proof, water-proof, oil-proof and dust-proof, humidity and atmospheric aging resistance.
The cured material has good insulation, compression, high bonding strength and other electrical and physical properties.
Product Application
Semiconductor BGA packaging, saving packaging, chip and wafer fixing, mems sensor packaging, automotive electronics module sealing.
Method of use
◆ Before use, it must be warmed at room temperature for more than 4h, and do not open the package before returning to room temperature.
◆ It is recommended that the dispensing pressure be 0.25-0.40MPa, use 18 or 22 needles, and the dispensing speed be 4-10 mm/s.
◆ Under the condition of 25 ℃, the pot life is 7 days.
◆ The unused glue shall be placed in a plastic bag for sealing and then stored at -20 ℃.
Product Parameters
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