Baigao BEEP 6688-15 Black Fast Curing Low Viscosity One-Component Epoxy Structural Adhesive
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
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Detailed description
Product characteristics
◆ High bonding strength
◆ Low linear expansion coefficient
◆Good toughness and high and low temperature impact resistance
◆ Medium and low temperature fast curing
Product Application
◆Miniaturization
◆ Lightweight
◆ High power output
◆ Electrical and electronic equipment
Method of use
◆ If the epoxy glue is stored in a frozen environment, it must be taken out to the normal temperature environment before use. In the process of sizing.
◆ It should be avoided to place the glue in a high temperature environment to reduce the consistency of the glue, unless the test in this regard has been done in advance and proved to be feasible.
◆ Apply this glue directly to the surface of the object to be bonded after degreasing, derusting and roughening treatment, select appropriate tools to assist in gluing, and fix it with a jig. It is then cured according to the recommend heating conditions.
Product Parameters

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