XCede® HD2
XCede® HD2
XCede® HD2
+
  • XCede® HD2
  • XCede® HD2
  • XCede® HD2

XCede® HD2

We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.

Hotline Consultation:

Detailed description

Product Details

Higher density to meet 56G data rate requirements

The interface of this connector and XCede®HD和XCede®HD Plus is consistent, providing developers with a reliable, out-of-the-box solution to meet the stringent space and density requirements of fine board spacing and chassis design.

28 to 84 differential pairs/inch (11 to 33 differential pairs/cm)

3, 4, 6 differential pair configuration

Modular construction with integrated power and steering options

Meet the hard metric form factor requirements of EN 61076-4-101:2001

90Ω impedance
 

features and advantages

Characteristics

Scalable data rates up to 56 Gb/s support system upgrades without additional cost redesign

Meet the hard metric form factor requirements of EN 61076-4-101:2001

Proprietary crosstalk reduction technology

15.7 mil drilled crimping feet to support deeper back drilling

Optimized package size

Shielded contacts are fitted before the signal contacts, providing a minimum sliding length of up to 4mm

Support for buried capacitors

28 to 84 differential pairs/inch (11 to 33 differential pairs/cm)

 

Advantages

Meet realistic performance requirements for future data rates while having a significant impact on current systems

High-density design with only 1.8mm pitch

Proven EMI shielding design and signal integrity benefits

Improved impedance matching

Comprehensive solutions for the unique needs of our customers

Support hot plug

Provides additional margin and saves overall system cost

Meet the need for higher density in leading-edge architectures
 

Recommend Products

Thermal interface material high thermal conductivity potting adhesive

High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.

Thermal interface material Thermal conductive gel

Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine

Thermal Interface Material Thermal Gasket

Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.

Thermal interface material Thermal conductive silicone grease

It is a common interface thermal material, often applied by printing or dot coating.

Online Consultation

* Note: Please fill in the information accurately and keep the communication unblocked. We will contact you as soon as possible

Submission