


XCede® HD2
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
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Product Details
Higher density to meet 56G data rate requirements
The interface of this connector and XCede®HD和XCede®HD Plus is consistent, providing developers with a reliable, out-of-the-box solution to meet the stringent space and density requirements of fine board spacing and chassis design.
28 to 84 differential pairs/inch (11 to 33 differential pairs/cm)
3, 4, 6 differential pair configuration
Modular construction with integrated power and steering options
Meet the hard metric form factor requirements of EN 61076-4-101:2001
90Ω impedance
features and advantages
Characteristics
Scalable data rates up to 56 Gb/s support system upgrades without additional cost redesign
Meet the hard metric form factor requirements of EN 61076-4-101:2001
Proprietary crosstalk reduction technology
15.7 mil drilled crimping feet to support deeper back drilling
Optimized package size
Shielded contacts are fitted before the signal contacts, providing a minimum sliding length of up to 4mm
Support for buried capacitors
28 to 84 differential pairs/inch (11 to 33 differential pairs/cm)
Advantages
Meet realistic performance requirements for future data rates while having a significant impact on current systems
High-density design with only 1.8mm pitch
Proven EMI shielding design and signal integrity benefits
Improved impedance matching
Comprehensive solutions for the unique needs of our customers
Support hot plug
Provides additional margin and saves overall system cost
Meet the need for higher density in leading-edge architectures
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