PCI Express® DirectAttached™ CEM 卡缘连接器
+
  • PCI Express® DirectAttached™ CEM 卡缘连接器

PCI Express® DirectAttached™ CEM 卡缘连接器

We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.

Hotline Consultation:

Detailed description

Product Details

32GT/S NRZ Differential Signal Connector for Next Generation Systems

Amferno 1.0mm pitch DirectAttached™The CEM series connector (DA CEM) is a hybrid card edge solution with high-speed signal pins that can be directly connected to the cable, which can effectively eliminate PCB trace losses. At the same time, it is equipped with crimp-terminated power pins for easy rework or maintenance.

Compared to PCIe®This typical expansion card solution DirectAttached™CEM connector with PCIe®When the expansion cable is used, it can reduce the SI loss of 0.5db to 1.0db.

Although the connector is encapsulated with standard PCIe®The CEM specification is different, but it conforms to the standard PCIe®AIC specification, and backward mating compatible with Gen 4/3/2/1 specifications

Amnoel has developed Gen 5 DA CEM, supporting X8 and X16 configurations, with a data rate of 32GT/s, which can meet PCIe requirements®Requirements of Gen 5.

Backward mating compatible with Gen 4/3/2/1 specifications, compliant with standard PCIe®interface.

Wide range of pin sizes available, supporting X8 and X16 configurations

Flexible installation ears to meet different customer needs

 

features and advantages

Features

Supports PCI-SIG CEM compliant X8 and X16 standard links

Backward Mover PCIe Compliant®CEM Standard

High-speed pin design, can be directly connected to the cable

RoHS compliant

Low halogen material

Advantages

Excellent performance with additional options for extreme bandwidth applications

Performance is better than Gen 5 specifications, but backward mating is also compatible with Gen 1/2/3/4 specifications

Eliminate PCB trace signal loss

Compliance with environmental, health and safety requirements

Meet new generation requirements

Recommend Products

Thermal interface material high thermal conductivity potting adhesive

High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.

Thermal interface material Thermal conductive gel

Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine

Thermal Interface Material Thermal Gasket

Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.

Thermal interface material Thermal conductive silicone grease

It is a common interface thermal material, often applied by printing or dot coating.

Online Consultation

* Note: Please fill in the information accurately and keep the communication unblocked. We will contact you as soon as possible

Submission