BESIL 8230(7#)A/B low-density silicone potting compound
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Classification:
Detailed description
Product characteristics
◇ Two-component addition molding low viscosity
1:1 mixing ratio
Low hardening shrinkage
Excellent high temperature electrical insulation
Low density, light and non-foaming
◇ Seismic noise elimination
Low dielectric constant
Product Application
Automotive electronic modules
◇ Lithium battery pack, capacitor bank
Rail traffic communication box
◇ Signal transmission device
Method of use
◇ Stir components A and B evenly in their respective packages before sizing, because the filler may partially settle during storage.
◇ Weigh the and B components according to the ratio of 1:1, mix evenly, and directly inject them into the components (or modules) that need potting protection. It is best to inject slowly along the side of the wall to reduce the generation of bubbles.
◇ Let the potted components stand still and let them discharge bubbles by themselves. After the bubbles basically disappear, they can be heated and cured, or they can be cured directly at room temperature. It takes about 8hr for preliminary curing.
◇ Please consult the marketing department of our company for potting equipment requiring quantitative glue filling.
Product Parameters
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E-mail:tingyu yuan@easystrive.com
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