BEPU 5100 A/B two-component polyurethane potting compound
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Detailed description
Product characteristics
Low viscosity, strong operability
Excellent low temperature characteristics, excellent weather resistance
Excellent mechanical properties
Good waterproof, moisture-proof, water absorption rate is very low
It has good adhesion to most metals and plastics.
Product Application
It is used for pouring and potting of communication equipment, transformer, control power supply, ignition controller, electronic sensor, etc.
Method of use
Material taking: Material A of this product contains functional filling powder, and the upper layer of the glue solution will have clear liquid. Before use, the original packaging glue solution needs to be stirred evenly before taking materials for use. After taking the material, seal the original package in time to prevent excessive contact with water. After the rubber material is exposed to the air for a long time, it may cause the phenomenon of bubbling after the AB material is mixed. Under the conditions, the original packaging of material A can be placed in a heat preservation environment of more than 30 degrees.
Operation matters: material B will absorb water and hydrolyze when exposed to the atmosphere. the phenomenon is that it becomes turbid until caking. material a also needs to be stored away from moisture to avoid excessive bubbles during curing. The environment of the curing process needs to control the humidity as low as possible, and the relative humidity should not exceed 60%.
Preheating: Please bake the cast device at 70~80 ℃ for 1~2 hours. The temperature may also be lowered and the heating time extended to remove moisture from the device. Bepu 6650 at low temperature, the viscosity will become higher, the material can be preheated to 25 ℃ ~ 45 ℃, easy to use.
Defoaming: vacuum the \B barrels respectively and stir at the same time to ensure that the \B glue is vacuum and bubble-free before mixing.
Pouring: The mixture is poured into the device through a static mixer, and the gel time is about 4 to 8hrs.
Curing: 25 ℃/72 hrs, ambient humidity should be controlled at <70%, low temperature should be appropriate to extend the curing time.
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