BEPU 6030 transparent light yellow polyurethane potting compound
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Detailed description
Product characteristics
◆ Excellent low temperature characteristics, excellent weather resistance
◆ Excellent flame retardancy,
◆ Excellent electrical insulation, stability
Good waterproof, moisture resistance, water absorption rate is very low
It has good adhesion to most metals and plastics
Product Application
BEPU6030 polyurethane potting glue is used for potting of electronic capacitors and automobile electronic modules. The control PCB boards of household appliances such as lampblack stoves, microwave ovens, electric cookers, washing machines, air conditioners, etc. are filled with glue and sealed. Moisture-proof and waterproof potting protection for circuit boards of life intelligent toilets, induction toilets, metal induction garbage cans and magnetic induction coils.
Method of use
1. Pre-drying: dehumidify the objects and circuit boards that need to be potted at 50 degrees, and transfer them to the area to be filled with glue after the pre-drying is completed.
2. Mixing: weigh A and B materials in proportion, stir vertically with stirring rod, and stir clockwise (or counterclockwise) for 2-3 minutes in the same direction to minimize stirring air. Note that the bottom and edge of the container should also be stirred evenly, otherwise there will be local non-curing phenomenon. During the whole operation process, glue A and B, mixing container and mixing tools shall be kept away from contact with water and moisture. The working environment is best to have air conditioning, constant temperature and humidity (temperature 23 ℃, humidity 50%).
3. defoaming: if the surface of potting is required to be smooth and free of bubbles, the mixture shall be vacuumed (≤-0.1mpa) to remove bubbles. Dynamic defoaming while stirring and vacuuming is more conducive to the removal of bubbles. Steps 1 and 2 are omitted for mechanical metering mixed potting. (It is recommended to use automatic mixing equipment, which can not only mix accurately in the correct ratio, but also will not introduce air to generate bubbles.)
4. Pouring: pouring the mixture into the device. If the device has complex structure and large volume, it should be poured in several times. Pouring bubbles can be purged with a hot air gun, etc. Can eliminate the surface bubble.
5. Components A and B must be sealed and stored. If they are not used at one time, cover the barrel again and store them in a sealed manner. Especially for component B, please minimize the contact time with air during each use.
6. Mix the component and the B component evenly in a short time in proportion. The mixed glue can only be used within a limited time (operable time), otherwise it will not be used.
7. The curing time is related to the amount and temperature of each mixture. When the amount is large or the temperature is high, the curing time will be relatively shortened. On the contrary, the curing time will be longer.
8. Before curing, the glue is easier to clean. After curing, please use dichloromethane to clean, soak, soften and peel off the glue.
9. Curing: 25 ℃/24h or 80 ℃/1h can be cured. The ambient humidity should be controlled at <50%, and the curing time should be extended as appropriate if the temperature is low.
10. Equipment glue filling only needs to vacuum the AB material in the material tank, measure and mix it, pour it into the object to be potted, and then cure or dry it through the tunnel furnace.
Product Parameters
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