BEGO BEEP 6225(62a) A/B Thermal Curing Potting Adhesive
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Detailed description
Product characteristics
◆ Low coefficient of linear expansion
◆Small curing shrinkage
◆High hardness, good toughness
◆ Excellent electrical insulation, thermal stability
◆ Low viscosity ◆ Temperature resistance grade H
◆ Temperature range -50-200 ℃
◆ Better resistance to high and low temperature impact performance
Product Application
Reactor, pressure sensor, temperature sensor, industrial control module, motor stator and other potting
Method of use
Preparation: Material A\B will settle in layers during storage, so put the package into an oven at 60 ℃ for 1 hour before each use, then take it out and stir it evenly. At this time, the viscosity will be lower than that at normal temperature, and weigh it at temperature. Glue preparation: components A and B are weighed and proportioned according to the weight ratio of 100:20. Stir evenly and vacuum defoam for later use. If necessary, the potted device can continue to vacuum, which is beneficial to increase the electrical performance of the device. Curing conditions: 80 ℃ * 2h 130 ℃/2h.
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