Baigao BEEP 6102 Universal Two-Component Normal Temperature Epoxy Potting Adhesive
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
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Detailed description
Product characteristics
◆Good toughness, high hardness
◆ Excellent adhesion and cracking resistance
◆ Excellent electrical insulation, stability
Good waterproof, moisture resistance, water absorption rate is very low
◆ Good temperature resistance, short time temperature resistance of 150 degrees
Product Application
Suitable for packaging and protection of automotive electronics, sensors and photoelectric LED and lighting products.
Method of use
◆ Clean the surface: clean the surface of the sticky or coated material, and clean it with a cleaning agent to remove rust, dust and oil stains.
Mixing: stir components A\B evenly before taking and using. Weigh components A and B at a ratio of 100:40, stir evenly and defoam in vacuum for later use, use up within 30 minutes, and drain bubbles at room temperature. If necessary, the potted device can continue to vacuum, which is beneficial to increase the electrical performance of the device.
◆ Curing: 25 ℃ * 24hrs; If fast curing is required, heating can be selected. 1hr is required under heating condition of 80 ℃.
◆ Precautions: In the process of mixing glue, note that the glue on the inner wall of the container must be turned back and stirred to ensure the uniformity of mixing glue. The curing time is greatly affected by temperature, and the BEGINOR winter formula can be selected in winter.
Machine dispensing: the curing agent and the main agent of this product will not cause damage to the equipment material, and the curing agent will not have monomer curing or crystallization phenomenon;
Product Parameters
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