BAIGO BESIL 8300 two-component room temperature heat/heat curing potting compound
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  • BAIGO BESIL 8300 two-component room temperature heat/heat curing potting compound

BAIGO BESIL 8300 two-component room temperature heat/heat curing potting compound

We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.

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Detailed description

Product characteristics

◆ Two-component addition silicone rubber
◆ Low hardening shrinkage
◆ Excellent high temperature electrical insulation, stability
◆ Excellent adhesion, the longer the curing, the better the adhesion
◆ Good waterproof and moisture-proof

Product Application

◆ Automotive electronics and modules;
◆ Power control module;
◆ Solar module junction box;
◆ Magnetic induction coil;
◆ Ceramic electrode;
◆ Vacuum circuit breaker

Method of use

◆ Weigh components A and B according to the ratio of 10:1, mix evenly, and directly inject them into the components (or modules) that need potting protection. It is best to inject slowly along the side of the wall to reduce the generation of bubbles.
◆ Let the potted components stand still and let them discharge bubbles by themselves. After the bubbles basically disappear, they can be heated and cured, or they can be cured directly at room temperature, which takes about 6 hours.

Product Parameters

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