BECOAT 9061 Solvent-based Silicone Potting Adhesive (Coating Adhesive)
+
  • BECOAT 9061 Solvent-based Silicone Potting Adhesive (Coating Adhesive)

BECOAT 9061 Solvent-based Silicone Potting Adhesive (Coating Adhesive)

We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.

Classification:

Hotline Consultation:

Detailed description

Product characteristics

BECOAT 9061 Solvent-based Silicone Potting Adhesive (Coating Adhesive)
◆ Single component, low viscosity solvent type
◆ High transparency, room temperature curing
◆ There are a variety of coating methods can be selected
◆ After curing, it is stable and elastic at -60 - 200 ℃, and easy to repair;
◆ It has good adhesion with most substrates without primer
◆ Excellent waterproof, anti-corrosion, moisture-proof and electrical insulation properties

Product Application

BECOAT 9061 Solvent-based Silicone Potting Adhesive (Coating Adhesive)
Suitable for coating of thick film circuit system and printed circuit board; LCM liquid crystal frame sealing; Other applications requiring good permeability;

Method of use

◆ Clean the surface: clean the surface of the sticky or coated material, and clean it with a cleaning agent to remove rust, dust and oil stains.
◆ Sizing: Cut the glue nozzle to the required size and load it into the glue gun. Squeeze the glue onto the cleaned surface to make it evenly distributed. When bonding, close and fix the bonded surface.
◆ Curing: The coated parts are placed in the air and can be put into use after 24 hours of curing at room temperature.
◆Precautions: After opening, use it once as much as possible, and once it is not used up. When using it again, squeeze out the cured part and continue to use it without affecting normal use.

Product Parameters

Recommend Products

Thermal interface material high thermal conductivity potting adhesive

High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.

Thermal interface material Thermal conductive gel

Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine

Thermal Interface Material Thermal Gasket

Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.

Thermal interface material Thermal conductive silicone grease

It is a common interface thermal material, often applied by printing or dot coating.

Online Consultation

* Note: Please fill in the information accurately and keep the communication unblocked. We will contact you as soon as possible

Submission