BEPU 6603 A/B polyurethane potting compound
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
Product characteristics
BEPU 6603A/B two-component polyurethane adhesive is a two-component solvent-free room temperature or heating curing resin elastomer combination material, used in two-component sealing, filling, flame retardant, thermal conductivity and other fields. Raw materials do not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating curing can be, can be deep curing, two components after mixing has good fluidity, excellent flexibility after curing,
Product Application
It is used for pouring and potting of communication equipment, transformer, control power supply, ignition controller, electronic sensor, etc.
Method of use
Preheating: the device to be cast, please bake at 70~80 ℃ for 1~2 hours can also reduce the temperature and extend the heating time to remove moisture from the device. Bepu 6603 at low temperature, the viscosity will become higher, can be preheated to 25 ℃ ~ 45 ℃ for easy use. ". Mixing: Mix evenly in the original package A, and then weigh. According to the proportion of weighing A, B material, stirring vertical stirring rod, clockwise (or counterclockwise) in the same direction of stirring for 2~3 minutes, to minimize stirring into the air. Note that the bottom and edge of the container should also be stirred evenly, otherwise there will be local non-curing phenomenon.
Defoaming: if the potting surface is required to be smooth and free of bubbles, the mixture shall be vacuumed (≤-0.1mpa) to remove bubbles. Dynamic defoaming while stirring and vacuuming is more conducive to the removal of bubbles. For mechanical metering mixed potting, steps 2 and 3 are omitted.
Pouring: pouring the mixture into the device. If the device has complex structure and large volume, it should be poured in different times. Pouring bubbles can be purged with a hot air gun, etc. Can eliminate the surface bubble. %. Curing: 25 ℃/24h or 80 ℃/1h can be cured. The ambient humidity should be controlled at <70%, and the curing time should be extended as appropriate if the temperature is low.
Curing: under the condition of insufficient curing time or low room temperature environment, it is normal that the surface will be sticky the next day, and it will gradually disappear after several days.
The curing of potting glue is affected by the temperature and the amount of glue, the temperature is high, the curing time is short, the amount of glue is more fast, and vice versa.
Product Parameters
Recommend Products
Thermal interface material high thermal conductivity potting adhesive
High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.
Thermal interface material Thermal conductive gel
Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine
Thermal Interface Material Thermal Gasket
Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.
Thermal interface material Thermal conductive silicone grease
It is a common interface thermal material, often applied by printing or dot coating.
Online Consultation
Contact Phone:+86 13510478804
E-mail:tingyu yuan@easystrive.com
Address: 12th Floor, Block C, Kupai Building, Intersection of Keyuan Avenue and Baoshen Road, Nanshan Gaoxin North District, Songpingshan Community, Xili Street, Nanshan District, Shenzhen
Focus on us