BESIL 8130 A/B two-component silicone potting compound
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
Product characteristics
Two-component silicone potting compound
◆ Automotive electronics, modules
◆ Various sensors ◆ Power control module
◆ Solar module junction box
◆ LED spotlights, wall washing lights, strip lights, LED fluorescent lamps
Product Application
◆ Two-component liquid silicone rubber, condensation dealcoholization type
◆ Low viscosity, easy processing, strong operation
◆ Low hardening shrinkage, no corrosion and no stress
◆ Excellent high temperature electrical insulation, stability
◆ Excellent adhesion, good waterproof and moisture resistance
Method of use
◆ Weigh components A and B according to the ratio of 6:1, mix evenly, and directly inject them into the components (or modules) that need potting protection. It is best to inject slowly along the side of the wall to reduce the generation of bubbles.
◆ Let the potted components stand still and let them discharge bubbles by themselves. Customers with conditions can vacuum and defoam the mixed glue before potting. Directly at room temperature
The conditions of curing, usually within 1hr to achieve the adhesive layer is elastic.
Add the amount of curing agent B material, can accelerate the curing speed of the mixture; reduce the amount of B material, can delay the curing speed of the mixture.
The influence of ambient temperature, the curing speed in winter will slow down, and the curing speed in summer will become faster.
◆ Please consult the marketing department of our company for potting equipment that requires quantitative glue filling.
Product Parameters

Recommend Products
Thermal interface material high thermal conductivity potting adhesive
High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.
Thermal interface material Thermal conductive gel
Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine
Thermal Interface Material Thermal Gasket
Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.
Thermal interface material Thermal conductive silicone grease
It is a common interface thermal material, often applied by printing or dot coating.
Online Consultation