BEGO BEEP 6112 Flame Retardant Two-component Epoxy Potting Adhesive
+
  • BEGO BEEP 6112 Flame Retardant Two-component Epoxy Potting Adhesive

BEGO BEEP 6112 Flame Retardant Two-component Epoxy Potting Adhesive

We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.

Classification:

Hotline Consultation:

Detailed description

Product characteristics

◆Good toughness, high hardness
◆ Excellent adhesion and cracking resistance
◆ Excellent electrical insulation, stability
Good waterproof, moisture resistance, water absorption rate is very low
◆ Good temperature resistance, short time temperature resistance of 150 degrees

Product Application

Suitable for automotive electronics, sensors and photoelectric LED, lighting products packaging protection

Method of use

◆ Clean the surface: clean the surface of the sticky or coated material, and clean it with a cleaning agent to remove rust, dust and oil stains.
◆ Mixing: Stir components A\B evenly before taking and using. Weigh components A and B in a ratio of 100:13, stir evenly and defoam in vacuum for later use,
◆ It can be used up within 30 minutes and can be discharged by itself at room temperature. If necessary, the encapsulated device can continue to vacuum, which is beneficial to increase the electrical properties of the device.
◆ Curing: 25 ℃ * 24hrs; If fast curing is required, heating can be selected. 1hr is required under heating condition of 80 ℃.
Note: In the process of mixing glue, note that the glue on the inner wall of the container must be turned back and stirred to ensure the uniformity of mixing glue. Curing time by temperature
The degree of influence is greater, winter can choose to use BEGINOR winter formula.
◆ Machine dispensing: the curing agent and the main agent of this product will not cause damage to the equipment material, and the curing agent will not have monomer curing or crystallization phenomenon; If you need to choose
◆ Please consult the BEGINOR market department for dispensing equipment.

Product Parameters

Recommend Products

Thermal interface material high thermal conductivity potting adhesive

High thermal conductivity potting glue is mainly used for high power density components potting, waterproof potting, thermal conductivity, heat dissipation and other aspects, such as new energy vehicles, electronic communications, solar photovoltaic, energy storage and other fields.

Thermal interface material Thermal conductive gel

Thermal conductive material with very low deformation force, with certain fluidity, strong plasticity, similar to plasticine

Thermal Interface Material Thermal Gasket

Easy to use-no heat and cure required; can be easily cleaned or reworked; use as you go.

Thermal interface material Thermal conductive silicone grease

It is a common interface thermal material, often applied by printing or dot coating.

Online Consultation

* Note: Please fill in the information accurately and keep the communication unblocked. We will contact you as soon as possible

Submission