Thermal Conductive Bonded Products
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Key words:
Classification:
Detailed description
ST0903It is a two-component epoxy functional thermal adhesive with high thermal conductivity efficiency and bonding strength, which is widely used in
LED, photovoltaic, semiconductor and thermal conductivity requirements of the module and other electronic and electrical products.
>>$100It is a two-component epoxy functional thermal adhesive with high thermal conductivity efficiency and bonding strength, which is widely used in
LED, photovoltaic, semiconductor and thermal conductivity requirements of the module and other electronic and electrical products.
>>GEL30A thermal conductive material that will not volatilize and dry out, solving the general use of traditional thermal paste.1-2There will be more dry days after the year.
, Meet the characteristics of silica gel, fill a variety of different gap widths, high capacity heat conduction, long-term reliability.
Typical applications
Power Supplies and Semiconductors
Storage and Power Modules
Processor
Consumer Electronics Products
Application Customer
Foxconn
Huawei
Apple, Google
Flextronics
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