Epoxy potting adhesive
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
Key words:
Classification:
Detailed description
Operating temperature:-40 °c ~ 105 °c
ShaoD75
Viscosity:8,100 cps
Color: Black
Mixing ratio (weight ratio)1:1
•Curing method:
Room temperature16 ～24hours or heated60°C
2an hour
Thermal conductivity:0.43W/mK
Insulation strength:16,800v/mm
•
U94v-0
• ROHS
DYMAX:
DYMAXFocusUVindustry, yes.UVInventor of glue couplant.
1•UVBenchmarking of the industry
One of the enterprises•Products includeUVGlue andUVEquipment•Main markets include electronics, automotive, medical
Industry.
Able to bond glass, plastic, metal, ceramic, etc
Materials.
, thermal, medical, optical-grade structural bonding.
Prototype sealing gaskets for quick cure, low compression
Rate of change is the best choice for sealing gasket applications•
The light-cured electron flooding film can be used on electronic components, and the cured flooding film is easy to peel off and has no residue.
circuit board solder joint
Protection.
, shallow potting/Encapsulation/Four-corner binding.
Micro speaker application:
Ren/magnetic core/Bonding of magnetic poles
TonexBonding of sound film
Beauty Rack+Bonding of basin dye
Xinyou Product Application-Adhesive for mobile phone camera module
Low temperature curing adhesive series
Application point and industry:
Assembly of camera module
Mobile phones, tablets, laptops
Product Features:
•High bonding strength of single component
•
80°CFast curing at the following temperatures
•
Can be bonded to a variety of materials
•Repairable
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E-mail:tingyu yuan@easystrive.com
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