Epoxy electronic adhesive two-component epoxy potting adhesive
We have strategic cooperation with more competitive electronic device manufacturers in the world, and continue to provide a wide range of electronic device products and perfect services for OEM manufacturers, ODM manufacturers and brand manufacturers, and continue to meet customer's differentiated needs, order rapid response processing needs, order fragmentation needs, cost reduction needs, technical support and operational management needs, etc.
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Detailed description
D211 two-component heat and room temperature curing heat conductive high temperature epoxy resin potting adhesive, with a long operation time, strong electrical properties, flame retardancy. In the linear motor potting, various types of sensor potting is widely used
DBT2 two-component epoxy resin potting adhesive, which can be cured at room temperature and heating, has the characteristics of suitable operation time, fast initial curing speed and high hardness, strong electrical properties and flame retardancy.
| Product Model | Curing conditions | Proportioning | Viscosity (mPa.s @ 25 ℃) | Hardness (D) |
Table dry time （min) |
CTE(K-1) | volume resistivity (Ω· cm) |
| JS-21(D211) | 80 ℃ 120 min |
A:B=1:1 | A:20000±4500 B:100±10 |
85 | -- | a1: 55 × 10-6 a2: 126 × 10-6 |
1 × 1015 |
| JS-21(DBT2) | Normal temperature | A:B=100:12 | A:10000±2000 B:130-320 |
85 | ＞ 60 | a1: 68 × 10-6 a2: 150 × 10-6 |
1 × 1015 |
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