Epoxy electronic adhesive one-component epoxy
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Giessen one-component low-temperature epoxy to provide consumer electronics, semiconductor, automotive electronics and other industries a full range of solutions, can meet the low-temperature curing bonding, high temperature resistance, thermal shock and other applications
SH21 is a low temperature fast heat curing one-component epoxy resin adhesive. It can form excellent adhesion between various substrate surfaces at a low temperature and in a very short time. Mainly used for memory card, LED backlight board lens bonding, CCD/CMOS assembly. It is especially suitable for the bonding of thermal components requiring low temperature curing.
SH30 is a one-component, heat-curable epoxy resin adhesive system. This series of adhesives has good adhesion to various substrate surfaces. High bonding strength, low stress, excellent resistance to moisture and heat. It has the advantages of simple bonding process, small curing shrinkage, good fatigue resistance, no volatile solvents, and little harm to the environment and human body. It is mainly used in the bonding and protection of electronic components.
| Product Model | Curing conditions | CTE(K-1) | Viscosity (mPa.s@25℃) |
Hardness (D) |
shear strength Degree (MP) |
curing volume shrinkage Rate (%) |
volume resistance Rate (Ω · cm) |
TG point (℃) |
| JS-21(SH21) | 80 ℃ 20 min |
a2: 152 × 10-6 | Viscosity: 13000 Ti: 4.0 |
80 | 15 | 3.6 | 1 × 1012 | 45 |
| JS-21(SH30) | 110 deg. 1 20min |
a1: 66 × 10-6 a2: 124 × 10-6 |
Viscosity: 11000±3000 Ti: 4.1 |
83 | 13.8 | 3.6 | 1 × 1014 | 110 |
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